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SKU:IC693CHS397
IC693CHS397 GE Fanuc 5-Slot CPU Master Backplane Chassis
Manufacturer: General Electric
Product No.: IC693CHS397
Product Type: CPU Baseplate
Product Origin: USA
Payment:T/T, Western Union
Weight: 650g
Shipping port: Xiamen
Warranty: 12 months
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Product Overview
The IC693CHS397 is a compact 5-slot Modular CPU Baseplate manufactured by GE Fanuc (now under Emerson Automation) for the renowned Series 90-30 Programmable Logic Controller (PLC) ecosystem. Operating as the primary control hub or master chassis (Rack 0) for space-conscious automation layouts, this unit integrates the system’s core communication backplane bus. It manages data transfers, distributes logic power, and establishes a secure structural foundation with a net physical weight of 0.65 kg to protect the primary CPU and adjacent field modules from mechanical stress.
Key Advantages
- Optimized Compact Design: Provides a space-saving 5-slot logical framework (1 dedicated CPU/specialty module channel and 4 standard I/O option slots) for targeted control environments.
- High Efficiency Power Draw: Consumes an exceptionally low internal current load of only 270 mA, lowering panel heat accumulation and optimizing power resource distribution.
- Scalable Expansion Capabilities: Outfitted with a right-hand 25-pin D-type female connector, permitting easy daisy-chain integration to remote and expansion sub-racks across distances up to 50 feet (15 meters).
- Lightweight Structure: Built with a rigid open-frame housing that maintains a low net weight of 0.65 kg, allowing for straightforward handling and rapid installation in complex enclosure setups.
Technical Specifications
| Model Designation | IC693CHS397 |
| Product Family / Series | Series 90-30 PLC System (GE Fanuc / Emerson) |
| Baseplate Classification | Modular CPU Master Rack (Default Node Address 0) |
| Total Available Slots | 5 Logical Slots (1 x CPU Module Slot | 4 x Multi-use I/O Slots) |
| Dedicated Power Slot | 1 x Leftmost Position (Excluded from standard slot count) |
| Expansion Bus Interface | 25-Pin D-Type Female Connector Port |
| Maximum Expansion Run | Up to 50 feet (15 meters) aggregate cable layout |
| Internal Backplane Circuitry | +5VDC Bus Voltage | 270 mA Internal Current Draw |
| Physical Net Weight | 0.65 kg (Approx. 1.43 lbs) |
| Dimensions (W x H x D) | 10.43 x 5.12 x 5.59 inches (Compact Footprint Profile) |
| Mounting Layout | Panel Mounting Orientation |
Quick Installation Tips
- Slot Location Blueprint: Always mount the primary system Power Supply Module in the unnumbered leftmost slot. Insert your primary Series 90-30 CPU or high-priority specialty processing card strictly into Slot 1, leaving Slots 2 through 5 open for standard discrete/analog I/O and communication extensions.
- Bus Interconnection Restrictions: When deploying downstream expansion or remote baseplates via the 25-pin D-type female interface, ensure the total aggregate cable length does not exceed the maximum operational limit of 50 feet (15 meters).
- Panel Installation: Mount the 0.65 kg open backplane assembly securely to a rigid, clean metal panel inside an electrical enclosure using appropriate screws and split-lock grounding washers.
Technical FAQs
Q1: Can this 5-slot baseplate operate as a secondary expansion rack without a CPU?
A1: No. The IC693CHS397 is explicitly designed as a main CPU Master Baseplate. It holds system address Rack 0 by default and requires a local processing unit in Slot 1. For secondary non-CPU sub-racks, separate expansion or remote baseplate units must be used instead.
Q2: Why is the power supply slot not factored into the official 5-slot configuration?
A2: GE Fanuc isolates the power supply module slot on the far left. This design provides 5 true logical channels for application and processor modules without wasting a system address space on power infrastructure.
Q3: How does the 270 mA internal load benefit high-density panel engineering?
A3: The minimal 270 mA consumption at +5VDC means the empty backplane draws very little power on its own. This leaves the vast majority of the power supply module's rated capacity available to drive power-heavy field devices and high-density I/O circuits.
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