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SKU:5069-ARM
5069-ARM Allen-Bradley Compact I/O Address Reserve Module
Manufacturer: Allen-Bradley
Product No.: 5069-ARM
Product Type: Address Reserve Module
Product Origin: USA
Payment:T/T, Western Union
Weight: 175g
Shipping port: Xiamen
Warranty: 12 months
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Tavsif
Product Overview
The 5069-ARM is a high-performance Address Reserve Module developed by Allen-Bradley for the Compact 5000 I/O platform. Weighing a lightweight 0.175 kg, this module visually and logically secures an empty slot within a control chassis for planned hardware expansions. It preserves the node address and I/O mapping structure within the Logix designer software configuration without breaking the physical backplane communication or power distribution layout, allowing future expansions without system re-architecting.
Core Technical Advantages
- Robust Passthrough Capabilities: Manages high-current backplane power routing, allowing up to 9.55 A of MOD power and 9.95 A of SA power to safely feed downstream functional modules.
- AC and DC Versatility: Supports heavy-duty AC system configurations up to 240V AC at 47-63 Hz, ensuring complete infrastructure flexibility across diverse automation panels.
- Hazardous Location Certification: Carries strict ATEX and IECEx compliance ratings, validating the hardware assembly for high-risk, volatile environment applications.
Technical Specifications
| Parameter | Specification Details |
|---|---|
| Model Number | 5069-ARM |
| Internal MOD Power | 45 mA @ 18 to 32V DC |
| Module Power Passthrough | 9.55 A @ 18 to 32V DC |
| Sensor Actuator (SA) Passthrough | 9.95 A @ 0 to 32V DC |
| Maximum AC Passthrough Power | 9.975 A @ 0 to 240V AC (47 to 63 Hz) |
| Product Net Weight | 0.175 kg (0.385 lbs) |
| Operating Ambient Temperature | 0°C to +60°C (32°F to 140°F) |
| Safety Certifications | ATEX, IECEx compliant |
Installation & Maintenance
- Chassis Placement Guidelines: Mount the module onto standard DIN rail frameworks. Push firmly onto the interlocking side connectors of adjacent modules until the latching mechanism clicks to guarantee complete bus contact.
- Thermal Management: Maintain a maximum surrounding air temperature boundary under 60°C. Ensure ventilation pathways above and below the module remain clear to handle natural heat dispersion.
- Future Upgrade Mapping: When exchanging the module for an active I/O block, ensure the new physical hardware matches the address parameters pre-allocated in the studio software profile.
Engineering Advantages
- Zero-Disruption Architecture: Eliminates continuous re-termination or logic modifications by allowing engineers to wire ahead for anticipated automation growth points.
- Low Mechanical Profile: The compact 0.175 kg footprint adds minimal weight strain to the DIN configuration while closing out physical backplane air pathways to shield system terminals.
- Unified Bus Continuity: Retains high-capacity bus tracks for both AC power setups and low-voltage DC signals across its integrated passthrough bridges.
Technical FAQs
Q1: Does the 5069-ARM module draw functional power from the bus?
A1: Yes. The module draws a small current of 45 mA at 18-32V DC to run its baseline identification logic, which should be included in your power budget estimations.
Q2: Can I pass high-voltage AC power through this module alongside low-voltage DC?
A2: No. The SA power passthrough configuration must follow the single voltage distribution structure assigned to that specific I/O bank group to prevent cross-voltage issues.
Q3: Is this module necessary if I leave a physical gap on the DIN rail?
A3: Yes. Leaving a blank gap on the rail separates adjacent modules and severs the backplane data bus. The 5069-ARM bridges this gap to ensure the system functions smoothly while keeping the slot reserved.
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